Proposal - 3D Printing Physics and Heat Exchange Simulation

The problem we plan to address is uncertain heat exchange and bonding properties in certain 3d printing materials, which cause defects and suboptimal structural performance. This is important because, as additive manufacturing becomes more prevalent and essential in industrial applications globally, understanding thermal exchange and the resulting bonding and structure is crucial to developing the utility of high throughput automated manufacture. Especially in high-strain uses like aerospace or aeronautics applications, it is crucial that we are able to design and manufacture with a concrete understanding of the bonding conditions during manufacture. From our simulation and analysis of 3d printing conditions, we hope to gain criteria for optimal heat transfer to maximize the strength and form of the resulting structure, beginning with optimizing the temperature of the plate (a very easy thing to change between real-world printing trials) but also concerning material choice and design characteristics that provide for generally effective bonding. To build a simulation to analyze and model the conditions of additive manufacture on product strength, etc., we will design a particle approximation of the system. First, we will start with a rudimentary structure that focuses sheerly on the heat transfer elements of the simulation without dynamic particle movement and physical interaction. Next, we will add physical interactions most likely modeled using Lennard Jones Potentials to approximate the highly complex particle interactions present. Intricacies of particle interactions may also be added later. Once complete, we can analyze bonding strength, structural form, and overall printing efficacy.